Qualcomm® RB3 Gen 2 Lite Development Kit

IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features

The Qualcomm RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.

The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm® QCM5430/QCS5430 processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems.

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Qualcomm® RB3 Gen 2 Development Kit

IoT development kit designed for high-performance compute, accessibility, and advanced features.

After a big success, Qualcomm® Robotics RB3 development kit now has a major upgrade. Powered by Qualcomm® QCS6490 Chipset, the Qualcomm® RB3 Gen 2 development kit is the latest development kit in the line. Compared to RB3, the performance of Gen 2 kit has been improved greatly.

• Contains advanced  platform Qualcomm® QCS6490 processor.
• Supports widely used Linux based distributions for IoT applications.
• The AI computing performance has increased by four times to an equivalent of 12 TOPS.
• Supports multiple SDKs and tools, including Qualcomm® Neural Processing SDK for AI, Qualcomm® Intelligent Multimedia Product SDK, Qualcomm® Intelligent Robotics Product SDK, Qualcomm® Hexagon™ DSP SDK, and multiple Linux distributions.
• Comprehensive set of demo applications and tutorials to accelerate development of IoT applications.
• Follows the design of the rest of RB series of products, it complaints with the 96Board, support for sensors such as multiple cameras, depth sensing solution, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range, multi-mic and additional sensors like IMU, pressure sensor, magnetometer etc.
• Multiple interfaces and I/Os which can connect multiple sensors.

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