D845 SOM

D660/D660Pro SOM D660/D660Pro SOM
C610/C410 SOM C610/C410 SOM

D845 SOM

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Thundercomm TurboX™ D845 SOM is a small size (60mm x 37mm) with a board to board connector, production ready and pre-certified system on module powered by the top-tier Qualcomm® Snapdragon™ 845 processor. This processor introduces new Qualcomm Hexagon 685 Vector DSP architecture, plus GPU and CPU optimizations, that together deliver up to three times faster processing of neural networks running on-device compared to the prior generation SoC. Thundercomm TurboX™ D845 SOM supports new architectures for AI, premium 4K@60fps in HDR ,new security layers and immersive XR experiences. It offers both Android and Linux OS for developers to choose. This will be an ideal platform for high computing power required embedded IoT products.

Overview

D845 SOM Applications

Medical Image

Smart City

Robot

Digital Signage

AR/VR

D845 SOM HW Block Diagram

Specifications

Category    Item Description
   Platform    Chipset Qualcomm® Snapdragon™ 845 processor
   CPU 64-bit applications processor (Kryo 385) with 2 MB L3 cache;
Quad high-performance Kryo cores 2.649 GHz – Kryo Gold cluster with 256 kB L2 cache per core,
Kryo Gold single- core boost at 2.803 GHz;
Quad low – power Kryo cores at 1.766 GHz – Kryo Silver cluster with 128 kB L2 cache per core
   GPU Qualcomm® Adreno™630 graphics processing unit(GPU) 4K 60 fps or 2 ⅹ2k 90 fps
OpenGL™ ES 3.2 + AEP , DX next, Vulkan® 1.1
OpenCL™ 2.0 full profile, RenderScript
   DSP Compute DSP with Qualcomm®Hexaron™Vector
Extensions (HVX) processor
   OS Android 10 / Linux
   Memory and Storage LPDDR4x 4GB + UFS 64GB
Multimedia    Display 2x MIPI-DSI 4-lane, Up to 3840*2400@60fps
   Camera Qualcomm® Spectra™ 280 ISP: Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI, Dual 14-bit ISP + one Lite ISP, up to 32MP
   Decode 4K60 decode for H.264 High Profile, H.265 Main 10 PROFILE and VP9 Profile 2
   Encode 4K60 encode for H.264 High Profile,
H.265 Main 10 Profile ; 4K30 encode for VP8
Connectivity    WIFI 802.11a/b/g/a/n/ac 2ⅹ2 MIMO
 Interface    Interface USB3.1 x 2;  PCIe2.1 x 1; PCIe3.0 x 1; SDIO 3.0ⅹ1;
TF card x 1; QUP for UART/I2C/SPI x 5, GPIO x8, MI2S x4;
Dimension    Size 60mm x 37mm x 6.4mm
System
Environment		    Power +3.8V/3A Input
   Operating Temp -25°C ~ +75°C
   Storage Temp -40°C ~ +70°C
   Relative Humidity 5 to 95% non-condensing