C6490 SOM

TurboX C6490 SOM (System on Module) is integrated with Qualcomm® QCS6490 SoC, a 6nm processor with superior performance, power efficiency and powerful computing (12.5 TOPS). It supports 4K@60FPS video decoding, 4K@30FPS video encoding, Wi-Fi 6E with DBS, Long Range Bluetooth, five MIPI CSIs, as well as a rich set of peripheral interfaces, including GPIO, UART, I2C, I3C, SPI, DSI, USB 3.1 and PCIe. C6490 SOM is a high performance AIoT SOM for building handheld devices, industrial robots, service robots, rugged tablet and edge computing, providing customers with hardware interfaces and software SDK to validate functions and build the prototype quickly.

Overview

C6490 SOM Applications

Rugged Handheld

Rugged Tablet

Edge Computing

Service Robot

Industrial Robot

C6490 SOM Features

6nm, power efficiency

5 x 4-lane MIPI CSI D-PHY
(2 of them compatible with 3-trio MIPI CSI C-PHY up to 48M camera)

Long life cycle, up to 2036

C6490 SOM

Superior computing capability (12.5 TOPS)

Wi-Fi 6E with DBS

BT5.2 with Long Range Bluetooth

Rich set of peripheral interfaces, e.g. PCIe 3.0, USB3.1, USB2.0, DSI

Specifications

Category C6490
Platform Qualcomm® QCS6490
Qualcomm® Kryo™ CPU 670
Qualcomm® Adreno™ GPU 642L, Adreno 633 VPU, Adreno DPU 1075
Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator
Qualcomm® Spectra™ 570L image processing
Memory 8GB+128GB uMCP
Connectivity 802.11 ax over PCIe with DBS, 2×2 MIMO (Wi-Fi 6E), Bluetooth 5.2
Encode 4K@30FPS for H.264/H.265
Decode 4K@60FPS for H.264/H.265/VP9
Display interfaces 1x MIPI-DSI 4-lane;
4K@30FPS via DSI;
4K@60FPS display support over DisplayPort
Camera Interfaces 5 x 4-lane MIPI CSI D-PHY(2 of them compatible with 3-trio MIPI CSI C-PHY up to 48M camera)
Peripherals 1 x USB 3.1 with DP, 1 x USB2.0, 1 x PCIe Gen3 2-lane,2 x Sound Wire, 1 x SDC for SD card, 3 x DMIC Interfaces, GPIOs, QUPs(UART/I2C/SPI)
Operating Environment Operation Temperature: -25°C ~ +75°C#
Operation  Humidity: 5%~95%, non-condensing
Form Factor LGA
Certifications FCC/CE
Voltage 3.4V ~ 4.5V, Typ. 3.8V
Dimensions 42.5mm x 35.5mm x 2.7mm
OS Support Android 13, LU, LE

#: The SOM operation temperature shall not exceed relevant IC temperature scope.

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