C6490P SOM

TurboX C6490P System on Module (SOM) integrates a high-performance and power-efficient Qualcomm® 6nm QCS6490 SoC with strong computing power (12.5 TOPS). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, five MIPI CSI interfaces, and rich external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.1, PCIe). TurboX C6490P SOM is a high-performance IoT intelligent module that can be used in industrial handheld device, industrial tablet, service robot, industrial robot, and edge computing. Customers can use its hardware interfaces and software SDK for functional verification and rapid prototyping.

TurboX C6490P SOM is pin-to-pin compatible with the TurboX C8550 SOM, with a more compact design and smaller size. It forms a high-AI performance module series matrix with the C8550 SOM, accelerating customer product iteration cycles and saving secondary development costs.

Overview

TurboX C6490P SOM Applications

Industrial Handheld

Rugged Tablet

Service Robot

Industrial Robot

Edge Computing

TurboX C6490P SOM Features

Excellent heat dissipation (non-pop)

Superior computing capability (12.5 TOPS)

Five MIPI-CSIs, compatible to support two C-PHY camera

C6490P SOM

Long life cycle: 2036

Pin to Pin compatible with TurboX C5430P & C8550 SOM

Rich set of peripheral interfaces, e.g. PCIe 3.0, USB3.1, USB2.0

Specifications

Category Description
Platform Qualcomm® QCS6490
Qualcomm® Kryo™ CPU 670
Kryo Gold plus: High-performance core up to 2.7 GHz
Kryo Gold: Three high-performance cores at 2.4 GHz
Kryo Silver: Four low-power cores at 1.9 GHz
Qualcomm® Adreno™ GPU 643, Adreno™ 633 VPU, Adreno™ DPU 1075
Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator
Qualcomm® Spectra™ 570L image processing
Memory LPDDR4x 8GB + UFS2.2 128GB, uMCP
Video Encode 4K@30FPS for H.264/H.265
Video Decode 4K@60FPS for H.264/H.265/VP9
Display interface 1 x MIPI-DSI 4-lane;
FHD+ (1080×2520) 8L @144FPS
Camera interface 5 x 4-lane MIPI CSI D-PHY (2 of them compatible to support C-PHY)
Peripherals 1 x USB 3.1 with DP, 1 x USB2.0, 2 x PCIe Gen 3 (1-lane, 2-lane), 2 x Sound Wire, 2 x SDC(4bit), 3 x DMIC Interfaces, GPIOs, QUPs (UART/I2C/SPI)
Operating Environment Operation Temperature: -35°C ~ +75°C#
Operation Humidity: 5%~95%, non-condensing
Form Factor LGA
Certification RoSH*/REACH*
Voltage 3.4V~4.5V
Dimensions 39mm x 33mm x 2.75mm (excluding height of the bottom shielding case)
OS Support Android 13, LU
LE – in planning

#: The SOM operation temperature shall not exceed relevant IC temperature scope.

*:  Planning

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