SA8255P 和 SA8775P Ride SX 4.0 汽车开发平台
最新的高通 Snapdragon Ride 汽车开发工具包，Ride SX 4.0 允许快速创建可定制的汽车驾驶舱解决方案，支持 SA8775P 或 SA8255P SoC。
该平台旨在增强对芯片组的测试和调试。通过一个背板电路板连接多个 CCA（组件电路板）组合，包括 SoC、显示器、摄像头、以太网、PCIe 以及各种测试卡和连接器。
应用领域：
Snapdragon Ride SoC 组件
SA8775P 和 SA8255P 的主要架构模块包括：
- 基于 Arm V8.2 Cortex 技术的高通 Kryo Gen-6 CPU；
- 高通 Adreno 663 GPU，提供卓越的图形性能和能效，以及安全的一般用途（GP）GPU 计算支持；
- 集成高通 Hexagon DSP 的 Hexagon 张量处理器，四个高通 Hexagon 矢量扩展（HVX）处理器，以及两个高通 Hexagon 矩阵扩展（HMX）协处理器，用于高性能机器学习应用。
SA8775P Flex SoC：
SA8775P 是下一代高通 Snapdragon 高级驾驶辅助系统（ADAS）和汽车信息娱乐 SoC，旨在为汽车应用提供卓越的性能和能效。该 SoC 设计采用“安全元素脱离上下文”（SEooC），目标为 ASIL D 用例。汽车安全完整性级别（ASIL）D 是应用于安全保障的最高标准。
SA8255P SoC：汽车信息娱乐
SA8255P 提供下一代高通 Snapdragon 汽车信息娱乐 SoC，旨在提供卓越的性能和能效。该 SoC 采用 SEooC 设计，目标为 ASIL B 用例，赋能汽车制造商提供连接、智能和感知的可扩展解决方案。
| Category | Description |
| Ride SX 4.0 FeatureSet Summary | |
| Power | +6 VDC to +20 VDC +12 VDC typical |
| SoC | Snapdragon Automotive SoC - available with SA8255P or SA8775P SoC |
| Memory | LPDDR5: 3 × 12 GB |
| Storage | Two 128 GB UFS 3.1 M.2 PCIe slot for optional NVMe SSD Octal SPI NOR |
| USB | Two USB 3.1 type A One USB 2.0 type A |
| PCIe | One PCIe Gen4 x2 One PCIe Gen4 x4 |
| Cameras/video input | Four mini-Quad FAKRA connect |
| Displays/video output | Four DisplayPorts |
| Sensors | One sensor card: GenX connector |
| GNSS | Qualcomm® SiRFStar™ Location V |
| Audio | Seven standard I2S Three high speed I2S AM / FM / DAB Six channel line out Four analog/mic inputs Two ADI A2B master nodes |
| Wired networking | RJ45 port connected to SafetyIsland Subsystem RJ45 port connected to Vehicle Interface Processor (VIP) Two RJ45 ports connected to SoC's SGMII ports Six CAN-FD: SoC Two CAN-FD: SoC – Partial Networking Two CAN-FD: VIP – Partial Networking Two LIN - VIP |
| Wireless Networking | Wi-Fi and Bluetooth: Via add-oncard |
| Test and debug | JTAG / SWD UART Test automation: Embedded ALPACA PSoC |
| Qualcomm SA8775P SoCand Qualcomm SA8255P SoC | |
| Processor | Quad Qualcomm® Kryo™ Kryo Gold Prime Cores |
| GPU | Qualcomm®Adreno™ 663 GPU |
| DSP | Qualcomm® Hexagon™ TensorProcessor integrated with Qualcomm Hexagon DSP Quad Qualcomm Hexagon Vector eXtensions (HVX) processor Dual Qualcomm Hexagon Matrix eXtensions (HMX) coprocessors |
| Safety Island (SAIL) Subsystem | Dedicated Safety Island (SAIL) Subsystem equipped with quad Cortex-R52CPU |
| Multimedia | Dual Adreno DPU1199 Two 4-lane MIPI-DSI Four embedded DisplayPort (eDP) / DisplayPort v1.4 |
| Camera | Qualcomm Spectra 690 ISP Four MIPI-CSI interfaces, configurable as D-PHY or C-PHY |
| Video | Adreno VPU 670 for high-quality,ultra HD video encode and decode Decode up to 4 x 4k60 or 4k240; AV1, HEVC, H.264, H.265, VP9, MPEG-2 Encode up to 2 x 4k60 or 4k120; HEVC, H.264 and H.265 |
| Memory | Six-channel high-speed memory -3200 MHz LPDDR5 SDRAM (6 x 16-bit) |
| Flash | Via UFS: Two UFS 3.1 Via Octal-SPI/Quad-SPI: NOR flash (up to 166 MHz) as SAIL domain boot updevice Via PCIe: NVMe (non-bootable) |
| Peripherals | Two USB 3.1 and one USB2.0 One 2-lane and one 4-lane PCIe Gen4 Eight SAIL domain CAN-FD interfaces Two SGMII 2.5 Gbps interfaces One SAIL domain RGMII interface |
Specifications and features are subject to change without notice. Qualcomm Adreno, Qualcomm AI Engine, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Snapdragon, and Qualcomm Spectra are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
